Thermal Engineering R&D Intern

Description:

Join our R&V team to support thermal design and simulation efforts for advanced semiconductor packaging test platforms. You may work on heat dissipation strategies and thermal modeling for PCBs, interposers, probe cards, and cooling solutions for the device under test.

Key Responsibilities:

Thermal Simulation & Analysis

* Perform thermal simulations (Convection/Conduction-based, steady-state/transient) to estimate heat dissipation across PCBs, Interposers, Test Thermal assemblies and probe cards.

Cooling Strategy Development

* Evaluate and propose cooling solutions (liquid cooling, heat sinks, air-cooled, zonal heaters) for advanced packaged devices.

Material & Interface Evaluation

* Research thermal interface materials (TIMs) and their impact on heat transfer efficiency.

Documentation & Reporting

* Prepare detailed thermal analysis reports and present findings in design reviews.

* Maintain organized documentation for future reference.

Cross-functional Collaboration

* Work closely with mechanical and electrical engineers to ensure thermal solutions align with fixture and test requirements.